Continually Working Toward Process Improvement

At John Deere Electronic Solutions, our processes are highly automated to manage costs for our customers and for consistent operation with the highest reliability.

In keeping with our philosophy of being a complete electronics supplier, we offer both batch and continuous-flow capabilities to support high- and low-volume production. We support through-hole and surface-mount designs, and have a full range of test and burn-in capabilities at both PCB and final assembly levels.

Our continuous improvement activities are the keystone of our manufacturing quality program. Daily, continuous improvement teams work with the operators on the floor to drive increases in our productivity, safety, quality, and delivery metrics.

Eliminating Waste, Increasing Profitability

John Deere Electronic Solutions strives for further efficiency and process improvements throughout the company by embracing a "lean manufacturing" philosophy that promotes better production controls to eliminate waste and increase profitability. Our manufacturing organization is a very metric-driven organization. We have manufacturing floor systems designed to monitor and track quality, so early detection of potential quality issues is an important part of the process. We have systems in place to monitor product yields and trends on the manufacturing equipment, tying it all together so that we know we are building a quality product every day based on the product monitoring metrics that we've developed.

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Manufacturing Capabilities

Automated Manufacturing Capabilities

  • High-speed, continuous-flow surface mount lines
  • Through-hole assembly
  • Automated Operator Assist stations
  • Pin insertion
  • Selective and Wave soldering
  • Clean and No-clean reflow soldering
  • Robotic gasketing, including Form in place – wet bead gasketing; cure in place
  • Conformal coating
  • Encapsulation/potting utilizing high accuracy pumps to deliver precise amounts of materials mixed in the correct ratios
  • Ultrasonic welding (100% leak testing to ensure seal)

Additional Processes

  • Staked pins
  • Pin insertion
  • Flexible Circuitry technology, including Flex Circuit Lamination and Flex Connectors
  • Hot bar solder
  • Bus bars
  • Membrane switches
  • Carbon-ink
  • In-circuit programming
  • BGA and Fine Pitch BGA

Support Services

We also offer a range of services designed to meet our customers’ needs at every level. These include: 

  • Shipping & Supply Logistics
  • Vendor-Managed Inventory
  • Customer-Managed Inventory
  • Supplier Development
  • Warranty Analysis & Management
  • Advanced Technology & Materials Analysis